封裝技術與設備
Packaging Technology and Equipment
| 節 | 週一 |
|---|---|
A 18:30–19:20 | 封裝技術與設備 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
This course introduces the fundamental concepts of the Packaging Technology and Equipment, as well as the process technology and corresponding failure analysis on the electronic packages.
Master students
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(1) 考試方式How tests are conducted..homework, assignments, mid-term exam, and final exam. (2) 考評項目其所佔總分比率Evaluation items, with their percentage of the total score.. Attendance: 10% Midterm Presentation: 30% Final exam (or report): 30% Final Report: 30%
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction to Electronic Packaging I |
| 第 2 週 | Introduction to Electronic Packaging II |
| 第 3 週 | Assembly and Process Technology in Electronic Packaging I |
| 第 4 週 | Assembly and Process Technology in Electronic Packaging II |
| 第 5 週 | Fundamentals of Single Chip Packaging |
| 第 6 週 | Fundamentals of Multi-chip Packaging |
| 第 7 週 | Fundamentals of First Level Packaging |
| 第 8 週 | Materials in First Level Packaging – TAB, Soldering & Sintering |
| 第 9 週 | Materials in First Level Packaging – Wire bonding & Si interposer |
| 第 10 週 | Mid-term: online presentation |
| 第 11 週 | Fundamentals of Wafer-Level Packaging |
| 第 12 週 | From Wafer-Level Packaging to Panel Level Packaging |
| 第 13 週 | Fundamentals of Thermal Management |
| 第 14 週 | Fundamentals of Reliability and Analysis I |
| 第 15 週 | Fundamentals of Reliability and Analysis II |
| 第 16 週 | Final Exam |
(1) Materials for Advanced Packaging 2nd Edition, Daniel¬ Lu¬ & C.P.¬Wong, Springer, 2009. (2) Wire bonding in microelectronics 3rd edition, George Harman, McGraw-Hill, 2009. (3) K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. (4) FUNDAMENTALS OF MICROSYSTEMS PACKAGING, By Rao R. Tummala, McGRAW-HILL
- 地點
- 教師未提供此項資料
- 時間
- Monday 17:00-18:00
- 聯絡方式
- chench@nycu.edu.tw