微電子積體電路製程
VLSI Manufacture Technology
| 節 | 週三 |
|---|---|
6 14:20–15:10 | 微電子積體電路製程 3 節連堂 |
7 15:30–16:20 | |
8 16:30–17:20 |
* 根據陽明交大上課時間表所列
This course provides a fundamental insight into the manufacturing technology of semiconductor devices and integrated circuits.
basics of fundamental physics, chemistry, and mathematics
無備註
Textbooks is downloadable via sources. Handouts will be given in the beginning of the semester.
Assignments and presentation: 30% Midterm exam (open book) 30% Final exam (open book) 40% *All assignments and exams are carried out online.
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction |
| 第 2 週 | Semiconductor Basics |
| 第 3 週 | SOI Materials and Devices |
| 第 4 週 | Epitaxy and Substrates |
| 第 5 週 | Thermal Process |
| 第 6 週 | Photolithography: Photomask fabrication, photoresist |
| 第 7 週 | Plasma Basics-Physical Vapor Deposition |
| 第 8 週 | Midterm Exam |
| 第 9 週 | Dopand Diffusion, Etching |
| 第 10 週 | Integrated-Circuit Packaging |
| 第 11 週 | Chemical Vapor Deposition and Low-K Dielectrics |
| 第 12 週 | Atomic Layer Deposition |
| 第 13 週 | Electrical, Physical and Chemical Characterization |
| 第 14 週 | Failure Analysis |
| 第 15 週 | Integrated Circuit Processing Technologies |
| 第 16 週 | Final Exam |
| 第 17 週 |
1. Introduction to Semiconductor Manufacturing Technology (2nd Edition) (Xiao, Hong, SPIE, 2012) 2. Handbook of Semiconductor Manufacturing Technology,Robert Doering, Yoshio Nishi, (CRC press, 2008) 3. Semiconductor Devices Physics and Technology, S.M. Sze (2nd Edition) (John wiley & SONS, INC, 2002)
- 地點
- online
- 時間
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- 聯絡方式
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